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Hardware Solutions

At Daria solutions’ we provide a wide range of high-quality hardware solutions designed to meet the needs of modern businesses and individuals. From powerful computing systems and smart devices to industrial-grade equipment, every product is carefully selected to ensure performance, durability, and seamless integration. Our mission is to equip you with the tools that drive efficiency, support digital transformation, and prepare you for a smarter tomorrow.

Why Daria solutions' Hardware Solutions

Powerful Hardware, Intelligent Software

Successful AI deployment requires reliable hardware infrastructure and smart software. By providing GPUs and Jetson alongside AI modules (DMS, CCS, HUB, ERP), we deliver a complete and scalable solution for organizations’ AI transformation.

Our Goals

Our Mission

Daria Solutions’ goal is to facilitate organizations’ access to AI technology and help them reduce costs, increase efficiency, and drive sustainable innovation in the global market.

Leveraging Advanced Technology

Empowering Digital Transformation
Boost Productivity andSatisfaction

Increase efficiency, profitability, and customer satisfaction.

Reducing Risks and Costs

Stay resilient while reducing risks and costs in uncertain markets.

ntelligent Decision-Making

Enable smart decisions across finance, production, supply chain, HR, and customer management.

Jetson

AI at the Edge, Compact and Powerful
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Nvidia_H200_NVL_Tensor_Core_141GB_grande

NVIDIA H200 NVL PCIe 141GB HBM3e

141GB HBM3e Memory: Offers significantly increased memory capacity for large workloads. 4.8 TB/s Bandwidth: Provides exceptionally fast data transfer speeds. NVIDIA Hopper Architecture: Powers next-generation AI and HPC performance. Passive Cooling: Designed for air-cooled server environments. PCIe 5.0 x16 Interface: Ensures high-speed connectivity within servers. NVLink Support: Enables high-speed multi-GPU communication. Multi-Instance GPU (MIG): Allows for secure partitioning of the GPU. Enhanced LLM Inference: Delivers faster performance for large language models. Optimized HPC Performance: Accelerates scientific computing applications. Energy Efficient: Provides better power efficiency than older GPUs.
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nvidia h100 nvl 94gb gpu

NVIDIA H100 nvl 94gb gpu

Memory: Equipped with 94GB of high-speed HBM3 memory. Architecture: Based on NVIDIA's advanced Hopper architecture. Connection: Uses the high-speed PCIe Gen5 x16 interface. Cooling: Features a passive cooling system, relying on server fans. Performance: Utilizes fourth-generation Tensor Cores for acceleration. Application: Optimized for large language model (LLM) inference. Interconnect: Supports NVLink for high-speed communication between multiple GPUs. Scalability: Includes Multi-Instance GPU (MIG) capability. Power: Has a configurable power consumption of 350-400W.
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900-13701-0050-000-2

Jetson AGX Orin 64GB Module

AI Performance: Up to 275 TOPS (INT8 Sparse) for heavy edge AI workloads. GPU: NVIDIA Ampere architecture with 2048 CUDA cores and 64 Tensor cores for deep learning acceleration. CPU: 12-core Arm Cortex-A78AE v8.2 64-bit with 3MB L2 + 6MB L3 cache for efficient multitasking. Memory: 64GB LPDDR5X with 204.8 GB/s bandwidth for large-scale data processing. Power Consumption: Configurable between 15-60W, suitable for portable and industrial devices. Connectivity: 2x NVDLA, 1x PVA v2, PCIe Gen4, and NVMe support for fast storage. Applications: Ideal for advanced robotics, autonomous vehicles, and video surveillance systems.
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product-2

Jetson Orin Nano Super Developer Kit

  • High processing power: up to 70–100 TOPS
  • Compact size: ideal for space-constrained devices
  • Optimized power consumption: 10–25 watts
  • Multi-camera support: simultaneous camera connections
  • NVIDIA software compatible: Jetson Linux ready
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product-1

Jetson T5000 Module

AI Performance: Up to 2070 FP4 TFLOPS with Blackwell GPU for next-gen physical AI and robotics. GPU: Blackwell architecture with 1536 cores and 64 Tensor cores for large models and dense sensor data. CPU: 14-core ARM Neoverse for complex, real-time processing. Memory: 128GB LPDDR5X 256-bit with 273 GB/s bandwidth for multi-stream processing. Power Consumption: 40-130W, configurable for heavy industrial applications. Connectivity: 4x 25GbE Ethernet, 1x PVA v3, and NVMe support via PCIe Gen5. Applications: Suited for humanoid robots, autonomous systems, and high-data-volume edge AI.
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Value Proposition

Transform your organization from complexity to productivity.
Expert Guidance & Flexible Options
Cost-Efficient Performance
Complete Hardware Ecosystem

GPU

Ultimate Performance for AI and Computing
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Nvidia_H200_NVL_Tensor_Core_141GB_grande

NVIDIA H200 NVL PCIe 141GB HBM3e

141GB HBM3e Memory: Offers significantly increased memory capacity for large workloads. 4.8 TB/s Bandwidth: Provides exceptionally fast data transfer speeds. NVIDIA Hopper Architecture: Powers next-generation AI and HPC performance. Passive Cooling: Designed for air-cooled server environments. PCIe 5.0 x16 Interface: Ensures high-speed connectivity within servers. NVLink Support: Enables high-speed multi-GPU communication. Multi-Instance GPU (MIG): Allows for secure partitioning of the GPU. Enhanced LLM Inference: Delivers faster performance for large language models. Optimized HPC Performance: Accelerates scientific computing applications. Energy Efficient: Provides better power efficiency than older GPUs.
View More
nvidia h100 nvl 94gb gpu

NVIDIA H100 nvl 94gb gpu

Memory: Equipped with 94GB of high-speed HBM3 memory. Architecture: Based on NVIDIA's advanced Hopper architecture. Connection: Uses the high-speed PCIe Gen5 x16 interface. Cooling: Features a passive cooling system, relying on server fans. Performance: Utilizes fourth-generation Tensor Cores for acceleration. Application: Optimized for large language model (LLM) inference. Interconnect: Supports NVLink for high-speed communication between multiple GPUs. Scalability: Includes Multi-Instance GPU (MIG) capability. Power: Has a configurable power consumption of 350-400W.
View More
900-13701-0050-000-2

Jetson AGX Orin 64GB Module

AI Performance: Up to 275 TOPS (INT8 Sparse) for heavy edge AI workloads. GPU: NVIDIA Ampere architecture with 2048 CUDA cores and 64 Tensor cores for deep learning acceleration. CPU: 12-core Arm Cortex-A78AE v8.2 64-bit with 3MB L2 + 6MB L3 cache for efficient multitasking. Memory: 64GB LPDDR5X with 204.8 GB/s bandwidth for large-scale data processing. Power Consumption: Configurable between 15-60W, suitable for portable and industrial devices. Connectivity: 2x NVDLA, 1x PVA v2, PCIe Gen4, and NVMe support for fast storage. Applications: Ideal for advanced robotics, autonomous vehicles, and video surveillance systems.
View More
product-2

Jetson Orin Nano Super Developer Kit

  • High processing power: up to 70–100 TOPS
  • Compact size: ideal for space-constrained devices
  • Optimized power consumption: 10–25 watts
  • Multi-camera support: simultaneous camera connections
  • NVIDIA software compatible: Jetson Linux ready
View More
product-1

Jetson T5000 Module

AI Performance: Up to 2070 FP4 TFLOPS with Blackwell GPU for next-gen physical AI and robotics. GPU: Blackwell architecture with 1536 cores and 64 Tensor cores for large models and dense sensor data. CPU: 14-core ARM Neoverse for complex, real-time processing. Memory: 128GB LPDDR5X 256-bit with 273 GB/s bandwidth for multi-stream processing. Power Consumption: 40-130W, configurable for heavy industrial applications. Connectivity: 4x 25GbE Ethernet, 1x PVA v3, and NVMe support via PCIe Gen5. Applications: Suited for humanoid robots, autonomous systems, and high-data-volume edge AI.
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